產(chǎn)品簡(jiǎn)介
Revasum’s 7AF-HMG grinding solutionextends wheel life by nine times, increasesuptime by 10%, boosts wafer output by 15percent, and reduces the cost of ownership by seven times. With a return on investment of less than one year, the choice for SiC grinding is clear: choose the 7AF-HMG.
詳情介紹
- Real-time grind performance monitoring
- A self-dressing grind process
- Grind spindles can be fitted with coarse or fine wheels
- Supports dual fine grind, dual coarse grind, and standard coarse/fine grind processing
- Wafer flipping available for double-side grinding applications
- In-situ, real-time thickness control
- Achieves <1µm TTV for most applications
- Astounding performance on wire sawn SiC wafers
- Designed to reduce consumables and operations costs
- Accommodates incoming wafers with varied thicknesses without presorting
- A wide process window, reduces setup time and increases process repeatability
- Surface finish can be optimized for subsequent processing
- Easy to maintain and to switch between wafer sizes
- Flexible process flows
- Air bearing spindles equipped with 8Hp motors
- Robust, contemporary Windows 7 based operating system
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